Strengthens Amkor’s leading position in Wafer-Level Packaging
Offers the market’s “best-in-class” Wafer-Level Fan-Out solution
TEMPE, Ariz.--(BUSINESS WIRE)--May 22, 2017--
Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it has
completed the acquisition of NANIUM S.A., a world class provider of
wafer-level fan-out (WLFO) semiconductor packaging solutions.
The acquisition of NANIUM will strengthen Amkor’s position in the fast
growing market of wafer-level packaging for smartphones, tablets and
other applications. NANIUM has developed a high-yielding, reliable WLFO
technology, and has successfully ramped that technology to high volume
“Amkor is a leader in wafer-level CSP and high-density integrated
fan-out technologies,” said Steve Kelley, Amkor’s president and chief
executive officer. “With the acquisition of NANIUM, we will have an
equally compelling value proposition in the low-density fan-out area.
NANIUM is widely viewed as the fan-out technology leader as well as a
very capable manufacturer, having shipped more than one billion WLFO
packages utilizing a state-of-the-art 300mm wafer-level packaging
NANIUM employs approximately 650 people and is based in Porto, Portugal.
About Amkor Technology
Amkor Technology, Inc. is one of the world’s largest providers of
outsourced semiconductor packaging and test services. Founded in 1968,
Amkor pioneered the outsourcing of IC packaging and test, and is now a
strategic manufacturing partner for more than 250 of the world’s leading
semiconductor companies, foundries and electronics OEMs. Amkor’s
operational base includes 10 million square feet of floor space with
production facilities, product development centers, and sales and
support offices located in key electronics manufacturing regions in
Asia, Europe and the U.S. For more information, visit www.amkor.com.
Forward-Looking Statement Disclaimer
This press release contains forward-looking statements within the
meaning of federal securities laws. All statements other than statements
of historical fact are considered forward-looking statements including,
without limitation, statements regarding growth in the market for
wafer-level packaging, the reliability of WLFO technology, Amkor’s
position in the wafer-level packaging and WLFO markets and ability to
build on NANIUM’s technologies and NANIUM’s future growth and the
acceptance and growth of its technology. These forward-looking
statements involve a number of risks, uncertainties, assumptions and
other factors that could affect future results and cause actual results
and events to differ materially from historical and expected results and
those expressed or implied in the forward-looking statements, including,
but not limited to, the ability of Amkor to successfully integrate
NANIUM’s operations. Other important risk factors that could affect the
outcome of the events set forth in these statements and that could
affect our operating results and financial condition are discussed in
the company's Annual Report on Form 10-K for the year ended December 31,
2016 and in the company's subsequent filings with the Securities and
Exchange Commission made prior to or after the date hereof. Amkor
undertakes no obligation to review or update any forward-looking
statements to reflect events or circumstances occurring after the date
of this press release.
View source version on businesswire.com: http://www.businesswire.com/news/home/20170522006261/en/
Source: Amkor Technology, Inc.
Amkor Technology, Inc.
Vice President, Finance
and Investor Relations