Press Releases

CHANDLER, Ariz.--(BUSINESS WIRE)--Aug. 8, 2001--Stacking two or more packages that have been fully tested, completed burn-in and been verified as 'known good devices,' is a reality using Amkor Technology's (Nasdaq:AMKR) etCSP(TM) package configuration.

Stacked etCSP(TM) packages provide reliability and flexibility to designers requiring the extra performance of an extremely thin, multiple-chip system, but who lack space on the motherboard.

"Stacked etCSP designs allow a 'system in a stack' approach to mixing different technologies such as memory, logic and mixed signal in a thin or small form factor," said David Zoba, Amkor's etCSP(TM) product manager. "Because the individual packages have already been tested and verified, the system in a stack approach provides much greater flexibility when integrating various devices into an optimized system such as Bluetooth(TM)."

A single package has a total height of 0.35 to 0.5 mm, while stacks of two and three packages have mounted heights that range between 0.7 - 1.0 mm and 1.1 - 1.7 mm, respectively. For higher stacks, package thickness depends on the number of printed circuit layers required in the high-density package on the bottom of the stack, according to Zoba.

The initial adoption for the etCSP(TM) package was in PCMCIA Type II removable hard disk drives. Stacked etCSP(TM) packages are being evaluated for application in MP3 players and memory cards that use high-capacity flash memory devices requiring test and burn-in before stacking to eliminate the risk of device yield loss. Other areas of interest for the stacked etCSP(TM) design include cell phone and personal communication applications where features and functions continue to be added without compromising size and weight reduction roadmaps.

The base etCSP(TM) package is constructed from a thin-core organic laminate with full sized 0.3 mm diameter solder balls on a standard

• 0.5 mm pitch. Conventional mold compound holds the wirebonded die in the "bottomless" cavity of the package. This unique package structure has proven to be more reliable than competing packages or bare die applications. Amkor is making this extremely thin packaging technology available to a wider range of die sizes and stacked device uses.

About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

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	            Investors:               
	            Jeff Luth
	            VP Investor Relations
	            610/431-9600
	            jluth@amkor.com