Corrent and Amkor Join Forces to Package, Assemble and Test Internet Security Processors
TEMPE, Ariz.--(BUSINESS WIRE)--April 6, 2001--
Corrent's New Family of Packet Armor(TM) and
Socket Armor(TM) Processors Housed in Amkor's Low-Profile,
High-Performance SuperBGA(R) Package
Amkor Technology Inc. (Nasdaq: AMKR), the world's largest provider of contract microelectronics manufacturing solutions and Corrent Corp., a semiconductor start-up company developing high-performance, standards-based Internet security chips, Friday announced an alliance for the assembly, testing and packaging of Corrent's scalable Internet security processors.
Amkor and Corrent have aligned forces to develop a package design based on Amkor's high performance SuperBGA(R) (super ball grid array) package which was selected for its low profile (1.4mm mounted height) and excellent thermal performance characteristics.
Corrent's first generation of products include a unique line of Packet Armor(TM) processors for Internet Protocol Secure (IPSec) transmissions and a family of Socket Armor(TM) processors that accelerate e-commerce transactions using secure socket layer (SSL) standards. Both families of processors encrypt data and send it securely across networks.
"Corrent's alliance with Amkor demonstrates our desire to provide our customers with the latest low-profile, low-thermal packaging based on a proven standard form factor for our new family of processors," said Richard Takahashi, president and chief executive officer of Corrent Corp.
"By combining our efforts with Amkor, Corrent will receive rigid testing and the best packaging power/performance ratio for our network security processors."
Amkor will produce prototype packages for evaluation, which will be followed by characterization, qualification and high volume production and test services beginning in Q4 of 2001. Corrent and Amkor will also collaborate to develop test software to ensure the end product meets complete product specifications.
All package development work is taking place at Amkor's Advanced Package Development Center in Chandler, Ariz., production will take place at Amkor's facility in Gwanju, South Korea.
"Amkor is pleased to be working side-by-side with Corrent to provide packaging that will deliver optimal power and performance and test programs that will ensure a robust end product," said Brian Lynch, vice president of advanced BGA packages, Amkor Technology.
"This strategic relationship will provide Corrent's customers with the peace of mind they need to meet the quality and performance demands of next-generation Internet security solutions."
About Corrent Corp.
Corrent Corp. is a semiconductor company focused on providing network system designers with the highest quality security chips at fiber optic speeds.
Corrent's Internet data security and acceleration processors are based on an advanced architecture optimized for maximum network transparency that eliminates traditional processing bottlenecks associated with the secure exchange of IP data through virtual private networks (VPNs) and business-to-business transactions.
Unlike traditionally architected software and hardware solutions, Corrent's security chips provide greater speed, scalability and compatibility with the industry's evolving fiber-optic security standards. For more information visit: http://www.corrent.com.
About Amkor Technology
Amkor Technology Inc. is the world's largest provider of contract microelectronics manufacturing solutions.
The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing.
More information on Amkor is available from the company's SEC filings and on Amkor's Web site: www.amkor.com.
|Mary Anne Pocrnic, 602/282-5465|