Press Releases

CHANDLER, Ariz.--(BUSINESS WIRE)--July 16, 2001--Amkor Technology (Nasdaq: AMKR) today announced that Philips Semiconductors, a division of Royal Philips Electronics (NYSE: PHG), has selected Amkor's MicroLeadFrame(TM) (MLF) package technology for Philips Semiconductors' power products designed for next generation PC microprocessors and other high current DSP/ASIC VR(M) applications.

Philips Semiconductors selected Amkor's MLF because the packaging company was able to optimize the MLF package for Philips' voltage regulation application.

Amkor's MicroLeadFrame(TM) package is a near-chip scale (CSP) plastic-encapsulated package with a copper leadframe substrate. The package also offers Amkor's ExposedPad(TM) technology as a thermal enhancement by having the die-attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die-attach material.

This package is suitable for central processor unit (CPU) voltage regulation module (VRM) power train applications because of its thermal properties. "The MLF(TM) package is ideal for advanced microprocessor voltage regulation applications and enables Philips to provide customers with a very thin package that will save up to 60 percent of board space when compared with a typical discrete configuration," said Bob Gee, VR(M) Solutions Group's product marketing manager, Philips Semiconductors. "The MLF also allows Philips to take advantage of its lower parasitics to operate at higher switching frequencies, helping customers to eliminate costly output bulk capacitors for decoupling."

About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronic OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's website: http://www.amkor.com.

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	            Investors:
	            Jeff Luth
	            VP Investor Relations
	            610/431-9600
	            jluth@amkor.com