Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP
Amkoris advancing the evolution of 5G RF module design
- Amkor DSMBGA enables integration of more components
The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US
Amkorcontinues to innovate in advanced SiP technologies
With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Amkor’s double-sided, molded ball grid array (DSMBGA) is a prime example of such solutions. Expanding on years of experience in delivering world-class, advanced System in Package (SiP) technology,
“With our DSMBGA platform, we’ve established a preferred advanced packaging solution for this domain,” said
The advanced packaging market for 5G RF FEM is projected to reach US
“There has been a change in frequencies with the arrival of 5G, adding frequency bands above 3 GHz in FR1, and mmWave in FR2,” according to
This growing number of new frequencies, combined with the variety of multiplexing methods, significantly increases the complexity of the RF front end. Integration using SiP allows customers to design, tune and test RF sub-systems, allowing for a reduction in design iterations and an accelerated time-to-market.
Amkor’s double-sided packaging technology has vastly increased the level of integration for RF front-end modules used in smartphones and other mobile devices. Common RF front-end modules consist of an LNA (low noise amplifier), power amp, an RF switch, RF filters and duplexers.
Amkor’s advanced SiP design rules and innovative DSMBGA technology enable the integration of additional components—such as antenna tuners and passive components—where device motherboard real estate is at a premium. This creates the most advanced and compact RF front-end module on the market today.
With additional power amplification and filtering circuitry, DSMBGA improves signal integrity and reduces losses, resulting in improved Rx/Tx amplification—which translates into reduced system power requirements.
In addition to its formidable SiP capacity and DSMBGA technology,
This toolset, combined with the company’s expertise in RF module design, characterization and bench test, uniquely positions
As demand for packages that support 5G increases,
1 Source: 5G Packaging Trends for Smartphones 2021 report, Yole Développement, 2021
2 Source: Cellular RF Front-End Technologies for Mobile Handset 2021 report, Yole Développement, 2021
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