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UNITED STATES SECURITIES AND EXCHANGE COMMISSION
Washington, DC 20549
FORM 8-K
CURRENT REPORT
Pursuant to Section 13 or 15(d) of the
Securities Exchange Act of 1934
Pursuant to Section 13 or 15(d) of the
Securities Exchange Act of 1934
Date of Report (Date of earliest event reported)
August 5, 2005
AMKOR TECHNOLOGY, INC.
(Exact name of registrant as specified in its charter)
| DELAWARE | 000-29472 | 23-1722724 | ||
| (State or Other Jurisdiction of Incorporation) |
(Commission File Number) | (IRS Employer Identification No.) |
1900 South Price Road
Chandler, AZ 85248
(Address of Principal Executive Offices, including Zip Code)
Chandler, AZ 85248
(Address of Principal Executive Offices, including Zip Code)
(480) 821-5000
(Registrant’s telephone number, including area code)
(Registrant’s telephone number, including area code)
Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the
filing obligation of the registrant under any of the following provisions (see General Instruction
A.2. below):
| o | Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425) |
| o | Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12) |
| o | Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b)) |
| o | Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c)) |
TABLE OF CONTENTS
| Item 1.01. Entry Into a Material Definitive Agreement. | ||||||||
| SIGNATURES | ||||||||
Table of Contents
Item 1.01. Entry Into a Material Definitive Agreement.
On August 5, 2005 Amkor Technology, Inc. (“Amkor”) reached resolution with Fairchild
Semiconductor Corporation (“Fairchild”) and Sumitomo Bakelite Co., Ltd.., Sumitomo Plastics
America, Inc. and Sumitomo Bakelite Singapore Pte. Ltd. (collectively “Sumitomo”) with respect to
pending litigation involving allegedly defective epoxy mold compound. Amkor has agreed to pay
Fairchild $3.0 million and release its claims against Sumitomo in consideration of a release from
all claims against Amkor related to this litigation. This settlement was previously accrued for in
our Consolidated Statement of Operations for the three months ended March 31, 2005.
Amkor will continue to incur legal expenses in defense of its other pending case related to
the mold compound litigation matter. This pending case is discussed in Amkor’s June 30, 2005 Form
10-Q.
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly
caused this report to be signed on its behalf by the undersigned hereunto duly authorized.
| AMKOR TECHNOLOGY, INC. | ||||
| By: | /s/ Kenneth T. Joyce | |||
| Kenneth T. Joyce | ||||
| Chief Financial Officer | ||||
Date: August 10, 2005 |