TEMPE, Ariz.--(BUSINESS WIRE)--May 3, 2016--
Amkor
Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor
packaging and test service provider, today announced the expansion of
its collaboration with Cadence
Design Systems, Inc. (NASDAQ: CDNS) to streamline semiconductor
package verification with the joint development of a package assembly
design kit (PADK) for Amkor’s SLIM™ and SWIFT™
advanced fan-out package technologies. As a leader in electronic design
automation, Cadence will provide Amkor with PADK development support
based on the Cadence®
Physical Verification System (PVS) software tool. This integrated
solution allows Amkor’s customers to shorten the SLIM and SWIFT design
and verification cycles.
“We’re at a critical juncture in the semiconductor industry with
increased dependence on packaging solutions for delivery of
next-generation products,” said Ron Huemoeller, Amkor’s corporate vice
president, research and development. “The development of these PADKs,
the latest outcome of our lengthy collaboration with Cadence, addresses
a critical gap forming between foundry and back-end-of-line, as fan-out
packaging solutions blur the lines between these processes. Based on our
vast experience with advanced package design methodologies, Amkor is
well positioned to lead the industry with our unique fan-out packaging
technologies.”
By jointly developing Cadence PVS-based PADKs for SLIM and SWIFT
technologies, Amkor and Cadence are filling the gap between
semiconductor die design and package design, while refining design
methodologies for advanced IC packaging fan-out technologies. Amkor’s
PADKs will enable designers to meet the design requirements needed to
ensure complete package-level sign-off verification for SLIM and SWIFT
technologies and provide more seamless collaboration with their
customers.
“To keep up with the industry’s faster-performing, lower-power and
smaller form-factor device requirements, fan-out processing is now an
essential part of advanced IC packaging,” said Steve Durrill, senior
product engineering group director of the PCB Group at Cadence Design
Systems. “Our partnership with Amkor fills a void when it comes to
complete sign-off verification for this advanced IC packaging
technology, helping to accelerate the adoption of SLIM and SWIFT
technologies in this fast growing market segment.”
About Amkor Technology, Inc.
Amkor Technology, Inc. is one of the world’s largest providers of
outsourced semiconductor packaging and test services. Founded in 1968,
Amkor pioneered the outsourcing of IC packaging and test, and is now a
strategic manufacturing partner for more than 250 of the world’s leading
semiconductor companies, foundries and electronics OEMs. Amkor’s
operational base encompasses more than 8 million square feet of floor
space, with production facilities, product development centers, and
sales and support offices located in key electronics manufacturing
regions in Asia, Europe and the U.S. For more information, visit www.amkor.com.
About Cadence
Cadence enables global electronic design innovation and plays an
essential role in the creation of today’s integrated circuits and
electronics. Customers use Cadence software, hardware, IP and services
to design and verify advanced semiconductors, consumer electronics,
networking and telecommunications equipment, and computer systems. The
company is headquartered in San Jose, Calif., with sales offices,
design centers and research facilities around the world to serve the
global electronics industry. More information about the company, its
products and its services is available at http://www.cadence.com.
Note: The Amkor name and logo are registered trademarks, and SLIM and
SWIFT are trademarks of Amkor Technology. Cadence and the Cadence logo
are registered trademarks of Cadence Design Systems, Inc. in the United
States and other countries. All other trademarks mentioned herein are
the property of their respective companies.
View source version on businesswire.com: http://www.businesswire.com/news/home/20160503005477/en/
Source: Amkor Technology Inc.
Media Contact:
Debi Polo
Amkor Technology, Inc.
480-786-7653
debi.polo@amkor.com
Reader
Contact:
Ruben Fuentes
Amkor Technology, Inc.
480-786-7753
ruben.fuentes@amkor.com