Amkor and ASAT Holdings Limited Enter Into Cross-License Agreement
CHANDLER, Ariz. and HONG KONG, April 6 /PRNewswire-FirstCall/ -- Amkor Technology, Inc. (Nasdaq: AMKR) and ASAT Holdings Limited (Nasdaq: ASTT) today announced that they have entered into a multi-year cross-licensing agreement under which ASAT will provide Amkor with a license for its Thin Array Plastic Package ("TAPP(TM)") semiconductor package technology, and Amkor will provide ASAT with a license for its Flip Chip semiconductor package technology. The agreement covers the license of intellectual property rights and transfer of associated packaging technologies.
ASAT's TAPP(TM) is a leadless, Pb-free and multi-row packaging solution. The very thin, fine-pitch package with an exposed die attach pad allows for optimal thermal performance and a power/ground ring option for enhanced electrical characteristics. The package has a similar form factor to a quad flat no lead (QFN) package, however, it can have up to three rows of peripheral I/O pads allowing for higher density. The TAPP(TM) package has been approved by JEDEC as a standardized package format.
"Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor's proprietary MicroLeadFrame(R) package technology and ASAT's Leadless Plastic Chip Carrier(TM) package. We look forward to integrating ASAT's TAPP(TM) with our MicroLeadFrame(R) family of packages to support our growing base of customers requiring innovative QFN package solutions," said Jim Fusaro, Amkor's corporate vice president for product management.
"Amkor provides the semiconductor industry with best in class manufacturing solutions for Flip Chip technology", said Mohan Kirloskar, vice president of package development for ASAT Holdings Limited. "The addition of Amkor's leading edge Flip Chip process know how to our portfolio will allow ASAT to meet customer requirements in the expanding Flip Chip market, by utilizing a proven manufacturing technology."
About Amkor:
Amkor Technology, Inc. is a leading provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
About ASAT Holdings Limited
ASAT Holdings Limited is a global provider of semiconductor assembly, test, and package design services. With 15 years of experience, the Company offers a definitive selection of semiconductor packages and world-class manufacturing lines. Today the Company has operations in the United States, Asia and Europe. ASAT Inc. is the exclusive distributor of ASAT Holdings Limited's services in the United States. For more information visit www.asat.com.
Contact:
Amkor Technology, Inc. For ASAT Holdings Ltd.
Jeffrey Luth Jim Fanucchi
VP Corporate Communications Summit IR Group Inc.
480-821-5000 ext. 5130 408-404-5400
jluth@amkor.com ir@asat.com
SOURCE Amkor Technology, Inc.
-0- 04/06/2005
/CONTACT: Jeffrey Luth, VP Corporate Communications of Amkor Technology,
Inc. +1-480-821-5000, ext. 5130, jluth@amkor.com; or Jim Fanucchi of Summit IR
Group Inc., +1-408-404-5400, ir@asat.com, for ASAT Holdings Ltd./
/Web site: http://www.amkor.com
http://www.asat.com/
(AMKR ASTT)
CO: Amkor technology, Inc.
ST: Arizona
IN: CPR SEM
SU: LIC
KM-MS
-- LAW008 --
3866 04/06/2005 08:11 EDT http://www.prnewswire.com