Amkor Offers

CHANDLER, Ariz., May 22, 2002 (BUSINESS WIRE) -- Amkor Technology, Inc. (Nasdaq:AMKR) has become the first contract semiconductor packaging company to exceed environmental requirements for "green" packages by qualifying its entire Chip Scale Package (CSP) portfolio without using lead and halide based materials, both of which are considered environmentally harmful under certain conditions. Amkor has the industry's largest CSP product portfolio, including single die packages, multi-chip and stacked packages, and advanced CSP packages.

Amkor's "green" CSP portfolio addresses Strategic Design for Environment (DfE) initiatives, which are underway by virtually all of Amkor's direct customers and end-users. In meeting these objectives more than five years ahead of some proposed timetables, Amkor has enabled many environmental practices to be implemented as soon as customers are ready for them. Amkor's CSP portfolio meets OEM, and European, North American and Asian consortia initiatives designed to reduce negative environmental impact during disposal. This is critical for many portable electronics, which plan for high rates of product obsolescence over successive product generations.

Amkor's "green" packages achieve higher performance during both OEM testing and moisture-soak stress testing with 260 (degree) C reflow conditions. Lead-free materials have been shown to improve performance of products during bend and drop tests, common tests for portable electronics. These improved reliability characteristics further help DfE by extending end-of-life behavior. In addition to "green" packages, Amkor is also developing the smallest and thinnest CSP packages available in the market place. Smaller packaging options further reduce total material use by eliminating waste in the manufacturing processes, as well as the final package itself.

"As consumer electronics evolve faster, product obsolescence and disposal will become a larger concern. Amkor is focused on offering solutions that eliminate potential environmental concerns while providing increased reliability and performance across the entire package family," says Jim Fusaro, Amkor's Vice President of CSP products.

Amkor's "green" environmental initiatives have been developed in accordance with several national and multinational industry consortia, including the World Business Council for Sustainable Development, the National Center for Manufacturing Sciences, and the European directive on Waste Electrical and Electronic Equipment, all of which are concerned with maximization of renewable resources, extension of product durability and life, and enhanced recyclability.

About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

CONTACT:          Amkor Technology, Inc.
                  Patrick McKinney
                  SVP Marketing
                  480/821-5000
                  pmcki@amkor.com

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