Press Releases

CHANDLER, Ariz., Aug 14, 2002 (BUSINESS WIRE) -- Amkor Technology Inc. (Nasdaq: AMKR) and Strand Interconnect AB announced today a joint qualification of Strand's SiliconMate(TM) substrates for Amkor's MQFP family of leadframe packages. Silicon based substrate technology provides high density interconnect for multi-chip lead frame packages, enabling silicon technology combinations for increased functionality and density inside the MQFP package. Typical applications would combine a microcontroller and a flash memory die, or a CPU and an SRAM die in the same package to reduce overall package footprint size, pin count and improve system density.

"Amkor's qualification of our substrate enables multi-chip functionality with routing densities and cost savings not previously available. We believe the use of silicon-based substrates will stimulate the adoption of multi-chip package solutions," said Gary Dudeck, Manager of US Applications Engineering for Strand Interconnect.

"We see enormous opportunities for multi-chip solutions in both die and package stacking as the microelectronics industry continues to embrace the benefits of system and silicon integration," said Sean Crowley, Amkor's vice president of advanced leadframe products. "The qualification of Strand's silicon based substrates in our MQFP packages will enhance our ability to provide innovative multi-chip package solutions. We will consider expanding our use of silicon substrates in other package families since the substrates are easy to integrate into our process flow and act just like another die in a package."

Amkor Technology, Inc. is the world's largest provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

Strand Interconnect AB is a supplier of high-density thin-film silicon substrates for use in Multi-chip packages. The company is based in Norrkoping, Sweden has been in volume production for over 2 years and is publicly traded on the Swedish Stock Market. Further information is available at www.strandinterconnect.com.

CONTACT:          Amkor Technology, Inc.
                  Jeffrey Luth, 480/821-2408 ext. 5130
                  or
                  Strand Interconnect Inc. USA
                  Dave Martell, 480/895-0888

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