Amkor Receives Advanced Packaging Award for 3+ Die Stack
The 2002 Advanced Packaging Awards were sponsored by Advanced Packaging magazine. Products were judged by an independent panel of industry experts who evaluated such characteristics as innovation, cost effectiveness, speed / throughput improvements, quality, ease of use, maintainability and environmental responsibility.
"We are delighted to receive this Advanced Packaging Award, which reflects the ongoing efforts of our engineers to develop 3-D package solutions that enable ongoing miniaturization of high technology applications," said Mike Steidl, Amkor's vice president of advanced product development.
Amkor's 3+ S-CSP packages have profile heights of 1.00, 1.20 or 1.40 mm, depending on the number of die to be stacked. Because Amkor's S-CSP have the same package outline as other Amkor and JEDEC single chip packages, customers may incorporate the S-CSP within their existing back-end infrastructure / processes.
About Amkor:Amkor is the world's largest provider of contract microelectronics assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
CONTACT: Amkor Technology, Inc.
VP Corporate Communications
Jeffrey Luth, 480/821-2408 ext. 5130
jluth@amkor.com
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