Amkor Technology and Carsem Jointly Announce Settlement
The parties have entered into a settlement agreement to end all pending
proceedings related to the dispute and Carsem will pay
Under the terms of the agreement, Carsem and
“We are pleased that Carsem has agreed to take a license to our industry
leading MLF patent family, and that we can finally close this
long-running dispute,” said
“With this settlement, we are happy that the dispute is behind us and
our customers will have the benefits of the license,” said
About
About Carsem
Carsem is a leading provider of turnkey packaging and test services to
the semiconductor industry, and offers one of the widest ranges of
package & test portfolios in the world. To meet the growing demands of
the telecommunications and wireless markets for smaller, faster,
thermally-efficient devices, Carsem's portfolio includes many advanced
technologies, such as the Micro Leadframe Package (MLP), Flip Chip on
Leadframe (FCOL™), an SiP (System-in-Package) Technology, Cavity-Package
Motion and Pressure Sensor technologies as well as stacked-die
capability. Carsem also offers a full range of turnkey test services for
RF, mixed-signal, linear, digital and power devices. Our factories
maintain world-class quality standards having achieved SAC Level 1,
ISO-9001, ISO-14001, QS-9000, TS16949, ANSI-ESD S20.20 certifications,
and are supported with a global network of sales and engineering support
offices. Carsem is a member of the
Source:
Amkor Technology, Inc.
Greg Johnson
Senior Director, Investor
Relations and Corporate Communications
480-786-7594
greg.johnson@amkor.com