Amkor Technology Completes Acquisition of NANIUM
- Strengthens Amkor’s leading position in Wafer-Level Packaging
- Offers the market’s “best-in-class” Wafer-Level Fan-Out solution
The acquisition of NANIUM will strengthen Amkor’s position in the fast growing market of wafer-level packaging for smartphones, tablets and other applications. NANIUM has developed a high-yielding, reliable WLFO technology, and has successfully ramped that technology to high volume production.
“Amkor is a leader in wafer-level CSP and high-density integrated
fan-out technologies,” said
NANIUM employs approximately 650 people and is based in
About
Forward-Looking Statement Disclaimer
This press release contains forward-looking statements within the
meaning of federal securities laws. All statements other than statements
of historical fact are considered forward-looking statements including,
without limitation, statements regarding growth in the market for
wafer-level packaging, the reliability of WLFO technology, Amkor’s
position in the wafer-level packaging and WLFO markets and ability to
build on NANIUM’s technologies and NANIUM’s future growth and the
acceptance and growth of its technology. These forward-looking
statements involve a number of risks, uncertainties, assumptions and
other factors that could affect future results and cause actual results
and events to differ materially from historical and expected results and
those expressed or implied in the forward-looking statements, including,
but not limited to, the ability of
View source version on businesswire.com: http://www.businesswire.com/news/home/20170522006261/en/
Source:
Amkor Technology, Inc.
Greg Johnson
Vice President, Finance
and Investor Relations
+1 480-786-7594
greg.johnson@amkor.com