Press Releases

CHANDLER, Ariz., May 9, 2002 (BUSINESS WIRE) -- Amkor Technology Inc. (Nasdaq: AMKR) announced today that it is the first to qualify a family of two die Stacked Chip Scale Packages (S-CSP) to meet 1.0mm low profile requirements for size and weight reduction in new generation wireless handsets. The four new S-CSP products allow the stacking of a wide range of combinations, including devices that are the same or similar die size, through the use of low profile wire bonding, thin die, thin die attach and thin spacer technologies. Qualified substrate technologies include either thin-core rigid or flex circuit tape based substrates to allow for the wide range of interconnect densities required for memory stacks or emerging logic plus memory device stacking.

"Amkor's qualification of this new 1.0mm stack CSP family, is significant because it matches well with the move to 1.0mm high chip capacitors. This allows for broader design flexibility to integrate more features and functions without sacrificing our size reduction roadmaps," said Yasunori Tanaka, Manager of Engineering for NEC's Mobile Terminal Technology Development Division.

Amkor has developed the industry's broadest 3D packaging product family by following a two-phase technology / product development and qualification strategy. The first phase implemented a continuous improvement of the underlying platform materials and process technologies, including advanced wafer thinning through handling; film or paste die attach; thin spacer assembly for same size die stacking; low loop and stand off stitch wire bonding; and high performance lead free and green materials on advanced substrate technologies. The second phase applied these 3D platform technologies across Amkor's broad leadframe and laminate based semiconductor packaging portfolio to meet a wide range of applications and diverse device combinations that deliver higher levels of silicon efficiency.

Ted Tessier, Vice President of Amkor's Advanced Applications Group stated, "The capabilities qualified in this new 1.0mm Stack CSP family, coupled with our commitment to aggressively execute our 3D packaging strategy, has enabled Amkor to deliver customer samples for a 1.0mm 4 die stack CSP using 75 micron thin die. In addition, we recently received a significant design win to develop and qualify a high density 3 die stack CSP for logic + memory applications. Our opportunities for 3D solutions in both die and package stacking are exploding as the industry embraces the benefits that 3D packaging provides for system and silicon integration."

    About Amkor:

Amkor is the world's largest provider of contract microelectronics assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.

CONTACT:          Amkor Technology Inc., Chandler
                  Jeffrey Luth
                  Vice President Corporate Communications
                  480/821-2408 ext. 5130
                  Patrick McKinney
                  Senior Vice President Corporate Marketing
                  480/821-2408 ext. 5179

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