Unitive Supports Production Requirements for Amkor Technology
RESEARCH TRIANGLE PARK, N.C., Aug. 28 /PRNewswire/ -- Unitive, Inc., the leading provider of wafer-level packaging solutions, and Amkor Technology (Nasdaq: AMKR), recently announced the qualification of Unitive's wafer bumping technology for use in Amkor's flip chip product family. This expands Unitive's current relationship with the world's largest contract provider of advanced packaging and test solutions. Amkor qualified Unitive's eutectic and high lead solder bump structures in packages ranging from its high density laminate based SuperFC(TM) to the smaller fcCSP(TM) offerings.
"Having successfully worked with Amkor for over a year in supplying electroplated high lead bumps, we are looking forward to expanding that relationship by beginning to support Amkor's volume production," said Bob Lanzone, Vice President of Marketing for Unitive.
The relationship will provide Amkor with second source options for solder bumping, multi-level copper redistribution capability, and access to wafer level chip scale package capacity targeting specific customers.
"Amkor is aggressively growing its flip chip product services and customer base. Seamless relationships with key players in the value chain like Unitive support this objective and ultimately provide value to our customers," said Richard Groover, Amkor's Vice President of Flip Chip Development.
Unitive's Research Triangle Park, NC and Hsin-Chu, Taiwan facilities will provide high lead and eutectic solder bumping for Amkor. This global flexibility permits customer specific supply chain optimization, adds value, and provides additional validation of the growing maturity of flip chip manufacturing services in general.
Specifically, the Unitive Semiconductor Taiwan (UST) facility in Hsin-Chu, Taiwan now provides a qualified source of solder bumping for Amkor to support product flows originating in local foundries.
"Unitive and Amkor are working to create a streamlined logistics flow for customers who require Asian supply chains for the movement of their products," said Lanzone. "UST's location in Hsin-Chu is strategically situated close to the major wafer foundries and Amkor's Taiwanese T1 facility, which enables efficient product flow from the fabs to the bumping facility, and on through assembly and test."
Amkor's relationship with UST provides it with opportunities for cost and cycle time reduction by locating bump manufacturing close to its assembly and test production lines.
About Amkor Technology
Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's Web site: http://www.amkor.com.
About Unitive, Inc.
Unitive is the leading provider of wafer-level packaging solutions that make semiconductors smaller, faster and lighter. The company partners with its customers to meet their product and global manufacturing needs through innovative deployment of its technologies, resulting in quicker time-to-market and lower costs. Unitive's services include multi-level passivation and thin film wiring, solder bumping, and chip scale packaging. The company's strategic investors include leading financial and industry pioneers such as Onex, Celestica, Flextronics, Fairchild Semiconductor and Conexant Systems. For more information, please visit http://www.unitive.com.
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SOURCE Unitive, Inc. and Amkor Technology
CONTACT: Patrick McKinney of Amkor Technology, Inc., +1-480-821-5000, ext. 5719, pmcki@amkor.com; Robert Lanzone of Unitive, Inc., +1-919-941-0606, ext. 132, rlanzone@unitive.com; Stacy Roth of The Ruth Group, +1-646-536-7016, sroth@theruthgroup.com, for Unitive, Inc./